Kina ALD producent, leverandør, fabrik


Thin film preparation processes can be divided into two categories according to their film forming methods: physical vapor deposition (PVD) and chemical vapor deposition (CVD), of which CVD process equipment accounts for a higher proportion. Atomic layer deposition (ALD) is one of the chemical vapor deposition (CVD).


Atomic layer deposition technology (Atomic Layer Deposition, referred to as ALD) is a vacuum coating process that forms a thin film on the surface of a substrate layer by layer in the form of a single atomic layer. ALD technology is currently being widely adopted by the semiconductor industry.


Atomic layer deposition process:


Atomic layer deposition usually includes a cycle of 4 steps, which is repeated as many times as needed to achieve the required deposition thickness. The following is an example of ALD of Al₂O₃, using precursor substances such as Al(CH₃) (TMA) and O₂.


Step 1) Add TMA precursor vapor to the substrate, TMA will adsorb on the substrate surface and react with it. By selecting appropriate precursor substances and parameters, the reaction will be self-limiting.

Step 2) Remove all residual precursors and reaction products.

Step 3) Low-damage remote plasma irradiation of the surface with reactive oxygen radicals oxidizes the surface and removes surface ligands, a reaction that is also self-limiting due to the limited number of surface ligands.

Step 4) Reaction products are removed from the chamber.


Only step 3 differs between thermal and plasma processes, with H₂O being used in thermal processes and O₂ plasma being used in plasma processes. Since the ALD process deposits (sub)-inch-thick films per cycle, the deposition process can be controlled at the atomic scale.



1st Half-CyclePurge2nd Half-CyclePurge



Highlights of Atomic Layer Deposition (ALD):


1) Grow high-quality thin films with extreme thickness accuracy, and only grow a single atomic layer at a time

2) Wafer thickness can reach 200 mm, with typical uniformity <±2%

3) Excellent step coverage even in high aspect ratio structures

4) Highly fitted coverage

5) Low pinhole and particle levels

6) Low damage and low temperature process

7) Reduce nucleation delay

8) Applicable to a variety of materials and processes


Compared with traditional chemical vapor deposition (CVD) and physical vapor deposition (PVD), the advantages of ALD are excellent three-dimensional conformality, large-area film uniformity, and precise thickness control, etc. It is suitable for growing ultra-thin films on complex surface shapes and high aspect ratio structures. Therefore, it is widely applicable to substrates of different shapes and does not require control of reactant flow uniformity.


Comparison of the advantages and disadvantages of PVD technology, CVD technology and ALD technology:


PVD technology
CVD technology
ALD technology
Faster deposition rate
Average deposition rate
Slower deposition rate
Thicker film thickness, poor control of nano-level film thickness precision

Medium film thickness

(depends on the number of reaction cycles)

Atomic-level film thickness
The coating has a single directionality
The coating has a single directionality
Good uniformity of large-area film thickness
Poor thickness uniformity
Average step coverage
Best step coverage
Poor step coverage
\ Dense film without pinholes


Advantages of ALD technology compared to CVD technology (Source: ASM)








Vetek Semiconductor is a professional ALD Susceptor products supplier in China. Our ALD Susceptor, SiC coating ALD susceptor and ALD Planetary Susceptor are widely used in key components of semiconductor manufacturing equipment. Vetek Semiconductor is committed to providing advanced and customizable ALD Susceptor products and technical solutions of various specifications for the semiconductor industry. We sincerely look forward to becoming your supplier in China.



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ALD-receptor

ALD-receptor

VeTek Semiconductor er en professionel producent af ALD Susceptor, CVD SiC belægning, CVD TAC COATING grafitbase i Kina. Vetek Semiconductor udviklede og producerede i fællesskab SiC-belagte ALD-planetbaser med ALD-systemproducenter for at opfylde de høje krav til ALD-processen og jævnt fordele luftstrømmen på underlaget. Vi ser frem til yderligere samarbejde med dig.

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SiC belægning ALD susceptor

SiC belægning ALD susceptor

Som en professionel SiC belægning ALD susceptor producent og leverandør i Kina, er VeTek Semiconductor's SiC belægning ALD susceptor en støttekomponent, der specifikt bruges i atomlagsdeposition (ALD) processen. Det spiller en nøglerolle i ALD-udstyret og sikrer ensartetheden og præcisionen af ​​deponeringsprocessen. Vi tror på, at vores ALD Planetary Susceptor-produkter kan give dig produktløsninger af høj kvalitet.

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ALD Planetarisk Susceptor

ALD Planetarisk Susceptor

ALD-proces, betyder Atomic Layer Epitaxy-proces. Vetek Semiconductor- og ALD-systemproducenter har udviklet og produceret SiC-belagte ALD Planetary Susceptorer, der opfylder de høje krav fra ALD-processen til jævnt at fordele luftstrømmen over underlaget. Samtidig sikrer Vetek Semiconductors CVD SiC-belægning med høj renhed renhed i processen. Velkommen til at diskutere samarbejde med os.

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Som en professionel ALD producent og leverandør i Kina har vi vores egen fabrik. Uanset om du har brug for tilpassede tjenester for at imødekomme de specifikke behov i din region eller ønsker at købe avanceret og holdbar ALD fremstillet i Kina, kan du efterlade os en besked.
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